Capabilities
Our capabilities always give our customers a competitive edge. By using the industry's most sophisticated and latest materials and processes, our customers' are assured the most reliable, state of the art products. These latest capabilities include:
- Various unique materials including, Teflon, Flex, Rigid Flex, GETEK, Thermount, Rogers and other high performance materials
- Via-in-pad technology which utilizes silver conductive and non-conductive fillers
- In-house immersion silver plating process
- In-house wire bondable NI/AU process
- Fine line capabilities including, UL qualified .003" lines and space
| Specifications | Standard Technology | Advanced Technology |
|---|---|---|
| Number of Layers | 1-12 | 14-36 |
| Board Material | ||
| Minimum Board Thickness |
2 layer - 0.010"
4 layer - 0.020"
6 layer - 0.040"
8 layer - 0.062"
10 layer - 0.062"
12 layer - 0.062"
|
2 layer - 0.005"
4 layer - 0.010"
6 layer - 0.031"
8 layer - 0.040"
|
| Maximum Board Thickness |
2 layer - 0.125"
3-12 layer - 0.200"
|
0.250" - 0.325"
|
| Maximum Board Size |
16.5" x 22.5"
|
17.0" X 23.0"
|
| Layer Count Rigid | 18 Layers | 36 Layers |
| Layer Count Flex | 6 Layers | 12 Layers |
| Layer Count Rigid Flex | 10 Layers | 18 Layers |
| Copper Thickness | 0.5 oz. - 3 oz. | 4 oz. - 7oz. |
| Hole Aspect Ratio | 10 : 1 | 15 : 1 |
| Minimum Hole Size | 0.008" | 0.005" |
| Mechanical Drill | 0.008" | 0.005" |
| Laser Drill | 0.004" | 0.003" |
| Minimum Trace/Space | 0.004"/0.004" | 0.002"/0.002" |
| Minimum Drill-to-Copper | 0.010" | 0.003" |
| Minimum Pitch | 0.004" | 0.002" |
| Final Finish |
HASL
Lead Free HASL
ENIG
Hard Gold
Gold Fingers
Immersion Silver
OSP
|
ENEPIG
Wire BondableGold
Electroless Gold
Selective Gold
Immersion Tin
|
| Solder Mask |
LPI:
Green
Black
Red
Blue
Clear
|
LPI:
Yellow
White
Orange
Purple
Magenta
Dry Film
|
| Coverlay |
FR Coverlay
LF Coverlay
Flexible Soldermask
|
|
| Silk Screen |
White
Black
Yellow
|
Green
Red
Blue
|
| PCB Fabrication |
Scoring
Route
|
Jump Scoring
Milling
Laser Rout
|
| Additional Features |
Plated Slots
Non-plated Slots
Controlled Dielectric
Covered Vias
Counter Sinks
Counter Bores
Dual Access Flex
Book Binder Flex
|
Plated Edges
Plated Milling
Plated Counter Bores & Counter Sinks
Edge Castellation
Controlled Impedance
Silver Filled Vias
Non-Conductive Filled Vias
Copper Filled Vias
Plated Half Holes with clean edges
|
| Quality | IPC 6012 Class 1 & 2 IPC 6013 Class 1 & 2
|
IPC 6012 Class 3
IPC 6013 Class 3
ITAR
ISO 9001/2008
100% Netlist Testing
TDR Testing
X-Ray Fluorescence
|
| Special Technology |
Blind & Buried Vias
Laser Drilled Vias
Stacked micro Vias
Copper Filled Vias
Metal Backed Boards
Rigid-Flex Boards
Flex Boards
Chip Modules
|