Technology Innovation
At Circuitronics LLC/Price Circuits LLC, we only choose the best partners throughout the industry to ensure that we are always on top of the latest technology available for our customers. Some of these technologies include:
- Sequential lamination blind/buried vias and micro vias
- Stacked micro vias with copper fill
- Rigid up to 36 Layers with impedance control
- High performance materials including Megtron 6, Rogers, Arlon
- Hybrid stack-ups, PTFE, Polyimide, FR4, and BT
- Flex and rigid flex up to 24 Layers
- Flex silver EMI shielding
- Laser routing for flex and rigid flex
- Thermal management with aluminum or copper backed
- Engineering support for impedance and DFM
- Controlled impedance with TDR testing
- Net list electrical testing
We strive to meet and exceed our customers expectations. This starts with providing pro-active engineering support to our customers throughout the product development cycle.
Our commitment to quality
As our quality mission states, we constantly strive to meet and exceed our customers’ expectations. This starts with providing pro-active engineering support to our customers throughout the product development cycle. Components to ensure superior quality include:
- Highly trained and experienced quality engineers.
- ISO 9001:2008 certification
- Technologically advanced AOI systems.
- Superior registration system with SPC data.
- X-Ray Florescence system for the measurement of our precious metals plating.
- Automated analysis of all wet process area insuring all processes are at 100% all of the time.
- Smart drill and X-Ray verification in drilling for optimum registration done on all multilayers.
Click on the image to view zoom.
